| Course title | Construction of Electrical Equipments |
|---|---|
| Course code | KE/IKEZE |
| Organizational form of instruction | Lecture + Tutorial |
| Level of course | Bachelor |
| Year of study | 3 |
| Semester | Winter and summer |
| Number of ECTS credits | 4 |
| Language of instruction | Czech |
| Status of course | Compulsory |
| Form of instruction | Face-to-face |
| Work placements | This is not an internship |
| Recommended optional programme components | None |
| Lecturer(s) |
|---|
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| Course content |
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Preface, basic terminology. CAD,CAE design systems for electronics, especially for designing printed circuit boards Development of new electronic systems and devices. (design idea, schematic creation, PCB layout, prototyping, manufacturing, design verification). Schematic design - Creating schematic symbols, connections - part name, net name, buses - additional documentation ( text, 2D lines, logos, etc.). Printed circuit layout design - package library - net list - technology requirements - design strategy and verification. Technologic data - postprocessors (Gerber, Excellon) - film matrices. Basic electric properties of printed circuit boards - resistor, capacity, inductivity, impedance, fast signals propagation - calculating maximum current and voltage load level. Electromagnetic compatibility - interferences, electromagnetic field emission, design good PCB using EMC requirements. Designing rules - Component placement, elements and sectors - supply voltage and power distribution, grounding issues, - blocking power tracks, blocking and filtrating capacitors - analog and digital design requirements - galvanic isolation of inputs and outputs - design rules for traces. Documentation for manufacturing and assembling PCB - manufacturing documentation, assembly drawings - technologic. Technology of manufacturing PCB - basic materials (FR,CEM) - variants of printed circuit boards - manufacturing process of PCB boards (drilling, chemical and galvanic process) - surface finish ( solder mask, printing, chemical and galvanic) - mechanical finish ( cut, pressing, milling, V slotting techniques). Measuring and testing quality of PCB - quality process monitoring (analysis of defect) - IPC,IEC, IEEE norms, technology and specification - electric testers (flying probe, needle testers). Assembly technology - single double sided assembly - classic THT technology ( Through Hole Technology ) - SMT (Surface Mount Technology): BGA, UFP, CSP, COB, FLIP packages - construction variants, packaging of basic substrates, etc. - additional mechanical mounting: heat sinks, spec. connectors, etc. Soldering technology - hand soldering - machine soldering process (heat and overflow) - repairing strategy.
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| Learning activities and teaching methods |
| Monologic (reading, lecture, briefing), Demonstration, Projection, Laboratory work |
| Learning outcomes |
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The main scope of this study is to introduce actual technology and possibilities of how to design modern electronic devices. In this subject students will be informed about techniques and manufacturing processes of printed circuit boards (PCB), as well as assembly technology. Students will be informed about computer aided design systems and how they work. Primary task will be how to design printed circuit boards using design rules to perform product needs and electromagnetic compatibility requirements.
Students get knowledge about printed circuit boards. Especially how they are designed and manufactured including assembling technology of complex electronic devices. They will be informed about trends in CAD, CAM systems for electronics design & manufacturing process. |
| Prerequisites |
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Basic PC skills, basic knowledge of electronics, physics, material technology
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| Assessment methods and criteria |
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Oral examination, Written examination, Work-related product analysis
Students must attend the practices with a maximum of 3 absences allowed. Students will receive credit after they successfully pass final project - design of simple circuit board from schematics. |
| Recommended literature |
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| Study plans that include the course |
| Faculty | Study plan (Version) | Category of Branch/Specialization | Recommended semester | |
|---|---|---|---|---|
| Faculty: Faculty of Electrical Engineering and Informatics | Study plan (Version): Communication and Microprocessor Technology (2015) | Category: Electrical engineering, telecommunication and IT | 2 | Recommended year of study:2, Recommended semester: Summer |
| Faculty: Faculty of Electrical Engineering and Informatics | Study plan (Version): Communication and Microprocessor Technology (2016) | Category: Electrical engineering, telecommunication and IT | 2 | Recommended year of study:2, Recommended semester: Summer |
| Faculty: Faculty of Electrical Engineering and Informatics | Study plan (Version): Communication and Microprocessor Technology (2014) | Category: Electrical engineering, telecommunication and IT | 2 | Recommended year of study:2, Recommended semester: Summer |
| Faculty: Faculty of Electrical Engineering and Informatics | Study plan (Version): Communication and Microprocessor Technology (2013) | Category: Electrical engineering, telecommunication and IT | 3 | Recommended year of study:3, Recommended semester: Winter |